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1. general description the TDA8920B is a high ef?ciency class-d audio power ampli?er with very low dissipation. the typical output power is 2 100 w. the device is available in the hsop24 power package and in the dbs23p through-hole power package. the ampli?er operates over a wide supply voltage range from 12.5 v to 30 v and consumes a very low quiescent current. 2. features n zero dead time switching n advanced current protection: output current limiting n smooth start-up: no pop-noise due to dc offset n high ef?ciency n operating supply voltage from 12.5 v to 30 v n low quiescent current n usable as a stereo single-ended (se) ampli?er or as a mono ampli?er in bridge-tied load (btl) n fixed gain of 30 db in single-ended (se) and 36 db in bridge-tied load (btl) n high output power n high supply voltage ripple rejection n internal switching frequency can be overruled by an external clock n full short-circuit proof across load and to supply lines n thermally protected. 3. applications n television sets n home-sound sets n multimedia systems n all mains fed audio systems n car audio (boosters). TDA8920B 2 100 w class-d power ampli?er rev. 01 1 october 2004 preliminary data sheet
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 2 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er 4. quick reference data 5. ordering information table 1: quick reference data symbol parameter conditions min typ max unit general; v p = 27 v v p supply voltage 12.5 27 30 v i q(tot) total quiescent supply current no load; no ?lter; no rc-snubber network connected -5065ma stereo single-ended con?guration p o output power r l =3 w ; thd = 10 %; v p = 27 v - 110 - w r l =4 w ; thd = 10 %; v p = 27 v - 86 - w mono bridge-tied load con?guration p o output power r l =6 w ; thd = 10 %; v p = 27 v - 210 - w table 2: ordering information type number package name description version TDA8920Bth hsop24 plastic, heatsink small outline package; 24 leads; low stand-off height sot566-3 TDA8920Bj dbs23p plastic dil-bent-sil power package; 23 leads (straight lead length 3.2 mm) sot411-1
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 3 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er 6. block diagram pin numbers in parenthesis refer to the TDA8920Bj. fig 1. block diagram. coa023 out1 v ssp1 v ddp2 driver high out2 boot2 TDA8920Bth (TDA8920Bj) boot1 driver low release1 switch1 enable1 control and handshake pwm modulator manager oscillator temperature sensor current protection voltage protection stabi mode input stage mute 9 (3) 8 (2) in1m in1p 22 (15) 21 (14) 20 (13) 17 (11) 16 (10) 15 (9) v ssp2 v ssp1 driver high driver low release2 switch2 enable2 control and handshake pwm modulator 11 (5) sgnd1 7 (1) osc 2 (19) sgnd2 6 (23) mode input stage mute 5 (22) 4 (21) in2m in2p 19 (-) 24 (17) v ssd n.c. 1 (18) v ssa2 12 (6) v ssa1 3 (20) v dda2 10 (4) v dda1 23 (16) 13 (7) 18 (12) 14 (8) v ddp2 prot stabi v ddp1
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 4 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er 7. pinning information 7.1 pinning 7.2 pin description fig 2. pin con?guration TDA8920Bth. fig 3. pin con?guration TDA8920Bj. TDA8920Bth v ssd v ssa2 v ddp2 sgnd2 boot2 v dda2 out2 in2m v ssp2 in2p n.c. mode stabi osc v ssp1 in1p out1 in1m boot1 v dda1 v ddp1 sgnd1 prot v ssa1 001aab217 24 23 22 21 20 19 18 17 16 15 14 13 11 12 9 10 7 8 5 6 3 4 1 2 TDA8920Bj osc in1p in1m v dda1 sgnd1 v ssa1 prot v ddp1 boot1 out1 v ssp1 stabi v ssp2 out2 boot2 v ddp2 v ssd v ssa2 sgnd2 v dda2 in2m in2p mode 001aab218 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 table 3: pin description symbol pin description TDA8920Bth TDA8920Bj v ssa2 1 18 negative analog supply voltage for channel 2 sgnd2 2 19 signal ground for channel 2 v dda2 3 20 positive analog supply voltage for channel 2 in2m 4 21 negative audio input for channel 2 in2p 5 22 positive audio input for channel 2 mode 6 23 mode selection input: standby, mute or operating mode osc 7 1 oscillator frequency adjustment or tracking input in1p 8 2 positive audio input for channel 1 in1m 9 3 negative audio input for channel 1 v dda1 10 4 positive analog supply voltage for channel 1
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 5 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er 8. functional description 8.1 general the TDA8920B is a two channel audio power ampli?er using class-d technology. the audio input signal is converted into a digital pulse width modulated (pwm) signal via an analog input stage and pwm modulator. to enable the output power transistors to be driven, this digital pwm signal is applied to a control and handshake block and driver circuits for both the high side and low side. in this way a level shift is performed from the low power digital pwm signal (at logic levels) to a high power pwm signal which switches between the main supply lines. a 2nd-order low-pass ?lter converts the pwm signal to an analog audio signal across the loudspeakers. the TDA8920B one-chip class-d ampli?er contains high power d-mos switches, drivers, timing and handshaking between the power switches and some control logic. for protection a temperature sensor and a maximum current detector are built-in. the two audio channels of the TDA8920B contain two pwms, two analog feedback loops and two differential input stages. it also contains circuits common to both channels such as the oscillator, all reference sources, the mode functionality and a digital timing manager. the TDA8920B contains two independent ampli?er channels with high output power, high ef?ciency, low distortion and a low quiescent current. the ampli?er channels can be connected in the following con?gurations: ? mono bridge-tied load (btl) ampli?er ? stereo single-ended (se) ampli?ers. sgnd1 11 5 signal ground for channel 1 v ssa1 12 6 negative analog supply voltage for channel 1 prot 13 7 decoupling capacitor for protection (ocp) v ddp1 14 8 positive power supply voltage for channel 1 boot1 15 9 bootstrap capacitor for channel 1 out1 16 10 pwm output from channel 1 v ssp1 17 11 negative power supply voltage for channel 1 stabi 18 12 decoupling of internal stabilizer for logic supply n.c. 19 - not connected v ssp2 20 13 negative power supply voltage for channel 2 out2 21 14 pwm output from channel 2 boot2 22 15 bootstrap capacitor for channel 2 v ddp2 23 16 positive power supply voltage for channel 2 v ssd 24 17 negative digital supply voltage table 3: pin description continued symbol pin description TDA8920Bth TDA8920Bj
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 6 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er the ampli?er system can be switched in three operating modes with pin mode: ? standby mode; with a very low supply current ? mute mode; the ampli?ers are operational; but the audio signal at the output is suppressed by disabling the vi-converter input stages ? operating mode; the ampli?ers are fully operational with output signal. to ensure pop-noise free start-up the dc output offset voltage is applied gradually to the output between mute mode and operating mode. the bias current setting of the vi converters is related to the voltage on the mode pin; in mute mode the bias current setting of the vi converters is zero (vi converters disabled) and in operating mode the bias current is at maximum. the time constant required to apply the dc output offset voltage gradually between mute and operating can be generated via an rc-network on the mode pin. an example of a switching circuit for driving pin mode is illustrated in figure 4 . if the capacitor c is left out of the application the voltage on the mode pin will be applied with a much smaller time-constant, which might result in audible pop-noises during start-up (depending on dc output offset voltage and used loudspeaker). in order to fully charge the coupling capacitors at the inputs, the ampli?er will remain automatically in the mute mode before switching to the operating mode. a complete overview of the start-up timing is given in figure 5 . fig 4. example of mode selection circuit. 001aab172 sgnd mode pin mute/on r c r + 5 v standby/ mute
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 7 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er when switching from standby to mute, there is a delay of 100 ms before the output starts switching. the audio signal is available after v mode has been set to operating, but not earlier than 150 ms after switching to mute. for pop-noise free start-up it is recommended that the time constant applied to the mode pin is at least 350 ms for the transition between mute and operating. when switching directly from standby to operating, there is a ?rst delay of 100 ms before the outputs starts switching. the audio signal is available after a second delay of 50 ms. for pop-noise free start-up it is recommended that the time constant applied to the mode pin is at least 500 ms for the transition between standby and operating. fig 5. timing on mode selection input. 2.2 v < v mode < 3 v audio output operating standby mute 50 % duty cycle > 4.2 v 0 v (sgnd) time coa024 v mode 100 ms 50 ms modulated pwm > 350 ms 2.2 v < v mode < 3 v audio output operating standby mute 50 % duty cycle > 4.2 v 0 v (sgnd) time v mode 100 ms 50 ms modulated pwm > 350 ms
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 8 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er 8.2 pulse width modulation frequency the output signal of the ampli?er is a pwm signal with a carrier frequency of approximately 317 khz. using a 2nd-order lc demodulation ?lter in the application results in an analog audio signal across the loudspeaker. this switching frequency is ?xed by an external resistor r osc connected between pin osc and v ssa . an optimal setting for the carrier frequency is between 300 khz and 350 khz. using an external resistor of 30 k w on the osc pin, the carrier frequency is set to 317 khz. if two or more class-d ampli?ers are used in the same audio application, it is advisable to have all devices operating at the same switching frequency by using an external clock circuit. 8.3 protections the following protections are included in TDA8920B: ? overtemperature protection (otp) ? overcurrent protection (ocp) ? window protection (wp) ? supply voltage protections: C undervoltage protection (uvp) C overvoltage protection (ovp) C unbalance protection (ubp). the reaction of the device on the different fault conditions differs per protection: 8.3.1 overtemperature protection (otp) if the junction temperature t j > 150 c, then the power stage will shut-down immediately. the power stage will start switching again if the temperature drops to approximately 130 c, thus there is a hysteresis of approximately 20 c. 8.3.2 overcurrent protection (ocp) when the loudspeaker terminals are short-circuited or if one of the demodulated outputs of the ampli?er is short-circuited to one of the supply lines, this will be detected by the overcurrent protection (ocp). if the output current exceeds the maximum output current of 8 a, this current will be limited by the ampli?er to 8 a while the ampli?er outputs remain switching (the ampli?er is not shut-down completely). the ampli?er can distinguish between an impedance drop of the loudspeaker and low-ohmic short across the load. in the TDA8920B this impedance threshold (z th ) depends on the supply voltage used. when a short is made across the load causing the impedance to drop below the threshold level (< z th ) then the ampli?er is switched off completely and after a time of 100 ms it will try to restart again. if the short circuit condition is still present after this time this cycle will be repeated. the average dissipation will be low because of this low duty cycle.
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 9 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er in case of an impedance drop (e.g. due to dynamic behavior of the loudspeaker) the same protection will be activated; the maximum output current is again limited to 8 a, but the ampli?er will not switch-off completely (thus preventing audio holes from occurring). result will be a clipping output signal without any artefacts. see also section 13.6 for more information on this maximum output current limiting feature.
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 10 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er 8.3.3 window protection (wp) during the start-up sequence, when pin mode is switched from standby to mute, the conditions at the output terminals of the power stage are checked. in the event of a short-circuit at one of the output terminals to v dd or v ss the start-up procedure is interrupted and the system waits for open-circuit outputs. because the test is done before enabling the power stages, no large currents will ?ow in the event of a short-circuit. this system is called window protection (wp) and protects for short-circuits at both sides of the output ?lter to both supply lines. when there is a short-circuit from the power pwm output of the power stage to one of the supply lines (before the demodulation ?lter) it will also be detected by the start-up safety test. practical use of this test feature can be found in detection of short-circuits on the printed-circuit board. remark: this test is operational during (every) start-up sequence at a transition between standby and mute mode. however when the ampli?er is completely shut-down due to activation of the overcurrent protection (ocp) because a short to one of the supply lines is made, then during restart (after 100 ms) the window protection will be activated. as a result the ampli?er will not start-up until the short to the supply lines is removed. 8.3.4 supply voltage protections if the supply voltage drops below 12.5 v, the undervoltage protection (uvp) circuit is activated and the system will shut-down correctly. if the internal clock is used, this switch-off will be silent and without pop noise. when the supply voltage rises above the threshold level, the system is restarted again after 100 ms. if the supply voltage exceeds 33 v the overvoltage protection (ovp) circuit is activated and the power stages will shut-down. it is re-enabled as soon as the supply voltage drops below the threshold level. so in this case no timer of 100 ms is started. an additional unbalance protection (ubp) circuit compares the positive analog (v dda ) and the negative analog (v ssa ) supply voltages and is triggered if the voltage difference between them exceeds a certain level. this level depends on the sum of both supply voltages. an expression for the unbalanced threshold level is as follows: v th(ub) ? 0.15 (v dda +v ssa ). when the supply voltage difference drops below the threshold level, the system is restarted again after 100 ms. example: with a symmetrical supply of 30 v, the protection circuit will be triggered if the unbalance exceeds approximately 9 v; see also section 13.7 . in t ab le 4 an overview is given of all protections and the effect on the output signal. [1] hysteresis of 20 degrees will in?uence restart timing depending on heatsink size. table 4: overview protections TDA8920B protection name complete shut-down restart directly restart every 100 ms otp y y [1] n [1] ocp n [2] y [2] n [2] wp y [3] yn uvp y n y ovpyyn ubp y n y
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 11 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er [2] only complete shut-down of ampli?er if short-circuit impedance is below threshold of 1 w . in all other cases current limiting: resulting in clipping output signal. [3] fault condition detected during (every) transition between standby-to-mute and during restart after activation of ocp (short to one of the supply lines). 8.4 differential audio inputs for a high common mode rejection ratio and a maximum of ?exibility in the application, the audio inputs are fully differential. by connecting the inputs anti-parallel the phase of one of the channels can be inverted, so that a load can be connected between the two output ?lters. in this case the system operates as a mono btl ampli?er and with the same loudspeaker impedance an approximately four times higher output power can be obtained. the input con?guration for a mono btl application is illustrated in figure 6 . in the stereo single-ended con?guration it is also recommended to connect the two differential inputs in anti-phase. this has advantages for the current handling of the power supply at low signal frequencies. 9. limiting values [1] current limiting concept. see also section 13.6 . fig 6. input con?guration for mono btl application. v in in1p out1 power stage mbl466 out2 sgnd in1m in2p in2m table 5: limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v p supply voltage - 30 v i orm repetitive peak current in output pin maximum output current limiting [1] 8- a t stg storage temperature - 55 +150 c t amb ambient temperature - 40 +85 c t j junction temperature - 150 c
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 12 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er 10. thermal characteristics [1] see also section 13.5 . 11. static characteristics table 6: thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient [1] TDA8920Bth in free air 35 k/w TDA8920Bj in free air 35 k/w r th(j-c) thermal resistance from junction to case [1] TDA8920Bth 1.3 k/w TDA8920Bj 1.3 k/w table 7: static characteristics v p = 27 v; f osc = 317 khz; t amb = 25 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit supply v p supply voltage [1] 12.5 27 30 v i q(tot) total quiescent supply current no load, no ?lter; no snubber network connected -5065ma i stb standby supply current - 150 500 m a mode select input; pin mode v i input voltage [2] 0- 6v i i input current v i = 5.5 v - 100 300 m a v stb input voltage for standby mode [2] [3] 0 - 0.8 v v mute input voltage for mute mode [2] [3] 2.2 - 3.0 v v on input voltage for operating mode [2] [3] 4.2 - 6 v audio inputs; pins in1m, in1p, in2p and in2m v i dc input voltage [2] -0-v ampli?er outputs; pins out1 and out2 ? v oo(se)(mute) ? mute se output offset voltage - - 15 mv ? v oo(se)(on) ? operating se output offset voltage [4] - - 150 mv ? v oo(btl)(mute) ? mute btl output offset voltage - - 21 mv ? v oo(btl)(on) ? operating btl output offset voltage [4] - - 210 mv stabilizer output; pin stabi v o(stab) stabilizer output voltage mute and operating; with respect to v ssp1 11 12.5 15 v
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 13 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er [1] the circuit is dc adjusted at v p = 12.5 v to 30 v. [2] with respect to sgnd (0 v). [3] the transition between standby and mute mode contain hysteresis, while the slope of the transition between mute and operating mode is determined by the time-constant on the mode pin; see figure 7 . [4] dc output offset voltage is applied to the output during the transition between mute and operating mode in a gradual way. the slope of the dv/dt caused by any dc output offset is determined by the time-constant on the mode pin. 12. dynamic characteristics 12.1 switching characteristics temperature protection t prot temperature protection activation - 150 - c t hys hysteresis on temperature protection - 20 - c table 7: static characteristics continued v p = 27 v; f osc = 317 khz; t amb = 25 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit fig 7. behavior of mode selection pin mode. stby mute on 5.5 coa021 v mode (v) 4.2 3.0 2.2 0.8 0 v o (v) v oo (mute) v oo (on) slope is directly related to time-constant on the mode pin table 8: switching characteristics v dd = 27 v; t amb =25 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit internal oscillator f osc typical internal oscillator frequency r osc = 30.0 k w 290 317 344 khz f osc(int) internal oscillator frequency range 210 - 600 khz external oscillator or frequency tracking v osc high-level voltage on pin osc sgnd + 4.5 sgnd + 5 sgnd + 6 v v osc(trip) trip level for tracking on pin osc - sgnd + 2.5 - v f track frequency range for tracking 210 - 600 khz
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 14 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er 12.2 stereo and dual se application [1] r sl is the series resistance of inductor of low-pass lc ?lter in the application. [2] output power is measured indirectly; based on r dson measurement. see also section 13.3 . [3] total harmonic distortion is measured in a bandwidth of 22 hz to 20 khz, using aes17 20 khz brickwall ?lter. maximum limit is guaranteed but may not be 100 % tested. [4] v ripple =v ripple(max) = 2 v (p-p); r s =0 w . [5] b = 22 hz to 20 khz, using aes17 20 khz brickwall ?lter. [6] b = 22 hz to 22 khz, using aes17 20 khz brickwall ?lter; independent of r s . [7] p o = 1 w; r s =0 w ; f i = 1 khz. [8] v i =v i(max) = 1 v (rms); f i = 1 khz. table 9: stereo and dual se application characteristics v p = 27 v; r l =4 w ; f i = 1 khz; f osc = 317 khz; r sl < 0.1 w [1] ; t amb =25 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit p o output power r l =3 w ; v p = 27 v [2] thd = 0.5 % - 87 - w thd = 10 % - 110 - w r l =4 w ; v p = 27 v [2] thd = 0.5 % - 69 - w thd = 10 % - 86 - w r l =6 w ; v p = 27 v [2] thd = 0.5 % - 48 - w thd = 10 % - 60 - w r l =8 w ; v p = 27 v [2] thd = 0.5 % - 36 - w thd = 10 % - 45 - w thd total harmonic distortion p o =1w [3] f i = 1 khz - 0.02 0.05 % f i = 6 khz - 0.03 - % g v(cl) closed loop voltage gain 29 30 31 db svrr supply voltage ripple rejection operating [4] f i = 100 hz - 55 - db f i = 1 khz 40 50 - db mute; f i = 100 hz [4] -55-db standby; f i = 100 hz [4] -80-db ? z i ? input impedance 45 68 - k w v n(o) noise output voltage operating r s =0 w [5] - 210 - m v mute [6] - 160 - m v a cs channel separation [7] -70-db ?d g v ? channel unbalance - - 1 db v o(mute) output signal in mute [8] - 100 - m v cmrr common mode rejection ratio v i(cm) = 1 v (rms) - 75 - db
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 15 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er 12.3 mono btl application [1] r sl is the series resistance of inductor of low-pass lc ?lter in the application. [2] output power is measured indirectly; based on r dson measurement. see also section 13.3 . [3] total harmonic distortion is measured in a bandwidth of 22 hz to 20 khz, using an aes17 20 khz brickwall ?lter. maximum limit is guaranteed but may not be 100 % tested. [4] v ripple =v ripple(max) = 2 v (p-p); r s =0 w . [5] b = 22 hz to 20 khz, using an aes17 20 khz brickwall ?lter. [6] b = 22 hz to 20 khz, using an aes17 20 khz brickwall ?lter; independent of r s . [7] v i =v i(max) = 1 v (rms); f i = 1 khz. 13. application information 13.1 btl application when using the power ampli?er in a mono btl application the inputs of both channels must be connected in parallel and the phase of one of the inputs must be inverted (see figure 6 ). in principle the loudspeaker can be connected between the outputs of the two single-ended demodulation ?lters. table 10: mono btl application characteristics v p = 27 v; r l =8 w ; f i = 1 khz; f osc = 317 khz; r sl < 0.1 w [1] ; t amb =25 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit p o output power r l =6 w ; v p = 27 v [2] thd = 0.5 % - 174 - w thd = 10 % - 210 - w r l =8 w ; v p = 27 v [2] thd = 0.5 % - 138 - w thd = 10 % - 173 - w thd total harmonic distortion p o =1w [3] f i = 1 khz - 0.02 0.05 % f i = 6 khz - 0.03 - % g v(cl) closed loop voltage gain 35 36 37 db svrr supply voltage ripple rejection operating [4] f i = 100 hz - 80 - db f i = 1 khz 70 80 - db mute; f i = 100 hz [4] -80-db standby; f i = 100 hz [4] -80-db ? z i ? input impedance 22 34 - k w v n(o) noise output voltage operating r s =0 w [5] - 300 - m v mute [6] - 220 - m v v o(mute) output signal in mute [7] - 200 - m v cmrr common mode rejection ratio v i(cm) = 1 v (rms) - 75 - db
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 16 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er 13.2 mode pin for pop-noise free start-up an rc time-constant must be applied on the mode pin. the bias-current setting of the vi-converter input is directly related to the voltage on the mode pin. in turn the bias-current setting of the vi converters is directly related to the dc output offset voltage. thus a slow dv/dt on the mode pin results in a slow dv/dt for the dc output offset voltage, resulting in pop-noise free start-up. a time-constant of 500 ms is suf?cient to guarantee pop-noise free start-up (see also figure 4 , 5 and 7 ). 13.3 output power estimation the achievable output powers in several applications (se and btl) can be estimated using the following expressions: se: (1) maximum current (internally limited to 8 a): (2) btl: (3) maximum current (internally limited to 8 a): (4) variables: r l = load impedance f osc = oscillator frequency t min = minimum pulse width (typical 150 ns) v p = single-sided supply voltage (so, if supply is 30 v symmetrical, then v p =30v) p o(1%) = output power just at clipping p o(10%) = output power at thd = 10 % p o(10%) = 1.24 p o(1%) . 13.4 external clock when using an external clock the following accuracy of the duty cycle of the external clock has to be taken into account: 47.5 % < d < 52.5 %. p o1 % () r l r l 0.4 + -------------------- v p 1t min f osc C () 2 2r l ----------------------------------------------------------------------------------------- = i o peak () v p 1t min f osc C () r l 0.4 + ------------------------------------------------------ = p o 1 % () r l r l 0.8 + -------------------- 2v p 1t min f osc C () 2 2r l -------------------------------------------------------------------------------------------- - = i o peak () 2v p 1t min f osc C () r l 0.8 + --------------------------------------------------------- =
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 17 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er if two or more class-d ampli?ers are used in the same audio application, it is strongly recommended that all devices run at the same switching frequency. this can be realized by connecting all osc pins together and feed them from an external central oscillator. using an external oscillator it is necessary to force pin osc to a dc-level above sgnd for switching from the internal to an external oscillator. in this case the internal oscillator is disabled and the pwm will be switched on the external frequency. the frequency range of the external oscillator must be in the range as speci?ed in the switching characteristics; see section 12.1 . in an application circuit: ? internal oscillator: r osc connected between pin osc and v ssa ? external oscillator: connect the oscillator signal between pins osc and sgnd; delete r osc and c osc . 13.5 heatsink requirements in some applications it may be necessary to connect an external heatsink to the TDA8920B. limiting factor is the 150 c maximum junction temperature t j(max) which cannot be exceeded. the expression below shows the relationship between the maximum allowable power dissipation and the total thermal resistance from junction to ambient: (5) p diss is determined by the ef?ciency ( h ) of the TDA8920B. the ef?ciency measured in the TDA8920B as a function of output power is given in figure 21 .the power dissipation can be derived as function of output power (see figure 20 ). the derating curves (given for several values of the r th(j-a) ) are illustrated in figure 8 . a maximum junction temperature t j = 150 c is taken into account. from figure 8 the maximum allowable power dissipation for a given heatsink size can be derived or the required heatsink size can be determined at a required dissipation level. r th j a C () t j max () t amb C p diss ------------------------------------ =
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 18 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er 13.6 output current limiting to guarantee the robustness of the class-d ampli?er the maximum output current which can be delivered by the output stage is limited. an advanced overcurrent protection (ocp) is included for each output power switch. when the current ?owing through any of the power switches exceeds the de?ned internal threshold of 8 a (e.g. in case of a short-circuit to the supply lines or a short-circuit across the load) the maximum output current of the ampli?er will be regulated to 8 a. the TDA8920B ampli?er can distinguish between a low-ohmic short circuit condition and other overcurrent conditions like dynamic impedance drops of the used loudspeakers. the impedance threshold (z th ) depends on the supply voltage used. depending on the impedance of the short circuit the ampli?er will react as follows: 1. short-circuit impedance > z th : the maximum output current of the ampli?er is regulated to 8 a, but the ampli?er will not shut-down its pwm outputs. effectively this results in a clipping output signal across the load (behavior is very similar to voltage clipping). 2. short-circuit impedance < z th : the ampli?er will limit the maximum output current to 8 a and at the same time the capacitor on the prot pin is discharged. when the voltage across this capacitor drops below an internal threshold voltage the ampli?er will shut-down completely and an internal timer will be started. (1) r th(j-a) = 5 k/w. (2) r th(j-a) = 10 k/w. (3) r th(j-a) = 15 k/w. (4) r th(j-a) = 20 k/w. (5) r th(j-a) = 35 k/w. fig 8. derating curves for power dissipation as a function of maximum ambient temperature. p diss (w) 30 20 10 0 t amb ( c) (1) (2) (3) (4) (5) 0 20 100 40 60 80 mbl469
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 19 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er a typical value for the capacitor on the prot pin is 220 pf. after a ?xed time of 100 ms the ampli?er is switched on again. if the requested output current is still too high the ampli?er will switch-off again. thus the ampli?er will try to switch to the operating mode every 100 ms. the average dissipation will be low in this situation because of this low duty cycle. if the overcurrent condition is removed the ampli?er will remain in operating mode once restarted. in this way the TDA8920B ampli?er is fully robust against short circuit conditions while at the same time so-called audio holes as a result of loudspeaker impedance drops are eliminated. 13.7 pumping effects in a typical stereo half-bridge (single-ended (se)) application the TDA8920B class-d ampli?er is supplied by a symmetrical voltage (e.g v dd = +27 v and v ss = - 27 v). when the ampli?er is used in a se con?guration, a so-called pumping effect can occur. during one switching interval, energy is taken from one supply (e.g. v dd ), while a part of that energy is delivered back to the other supply line (e.g. v ss ) and visa versa. when the voltage supply source cannot sink energy, the voltage across the output capacitors of that voltage supply source will increase: the supply voltage is pumped to higher levels. the voltage increase caused by the pumping effect depends on: ? speaker impedance ? supply voltage ? audio signal frequency ? value of decoupling capacitors on supply lines ? source and sink currents of other channels. the pumping effect should not cause a malfunction of either the audio ampli?er and/or the voltage supply source. for instance, this malfunction can be caused by triggering of the undervoltage or overvoltage protection or unbalance protection of the ampli?er. best remedy for pumping effects is to use the TDA8920B in a mono full-bridge application or in case of stereo half-bridge application adapt the power supply (e.g. increase supply decoupling capacitors).
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 20 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er 13.8 application schematic notes to the application schematic: ? a solid ground plane around the switching ampli?er is necessary to prevent emission. ? 100 nf capacitors must be placed as close as possible to the power supply pins of the TDA8920Bth. ? the internal heat spreader of the TDA8920Bth is internally connected to v ss . ? the external heatsink must be connected to the ground plane. ? use a thermal conductive electrically non-conductive sil-pad ? between the backside of the TDA8920Bth and a small external heatsink. ? the differential inputs enable the best system level audio performance with unbalanced signal sources. in case of hum due to ?oating inputs, connect the shielding or source ground to the ampli?er ground. jumpers j1 and j2 are open on set level and are closed on the stand-alone demo board. ? minimum total required capacity per power supply line is 3300 m f.
xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x 9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 21 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er fig 9. TDA8920Bth application schematic. 001aab224 c18 in1p in1 in2 in1m sgnd1 fb gnd sgnd2 8 9 11 2 5 4 31 c19 220 pf c23 1 nf c17 1 nf c30 1 nf c25 1 nf r8 470 nf 5.6 k w r3 5.6 k w 470 nf 5.6 k w c20 r10 c26 in2p in2m fb gnd fb gnd c28 220 pf r11 470 nf 5.6 k w r13 10 w r14 22 w out2m out2p ls2 c32 100 nf c9 100 nf c31 fb gnd 470 nf 5.6 k w c29 100 nf v dda v ssa 19 24 13 v ssa v ssp v dda2 v ssa2 prot n.c. 20 21 22 v ssp v ssp2 out2 boot2 23 v ddp v ddp2 v ssd c34 100 nf c35 fb gnd fb gnd 100 nf v dda v ssa c12 100 nf c13 v dda1 v ssa1 100 nf c37 15 nf c27 l4 100 nf c39 100 nf c38 v ssp v ddp 17 v ssp1 14 u1 v ddp1 6 mode 7 12 10 osc 100 nf c14 100 nf c16 100 nf c15 47 m f/ 63 v c8 100 m f/10 v c4 c3 470 m f/35 v c6 470 m f/35 v c33 220 pf 18 stabi c36 100 nf v ddp c40 220 pf c10 220 pf v ssp c41 220 pf r12 r2 10 w r5 10 w r7 10 w r6 30 k w r9 22 w r4 5.6 k w r1 5.6 k w dz1 5v6 s2 c2 47 m f/35 v c5 47 m f/35 v c1 100 nf 1 c7 100 nf s1 out1p out1m ls1 ls1/ls2 l3/l4 c22/c31 2 w 10 m h1 m f 4 w 22 m h 680 nf 6 w 33 m h 470 nf 8 w 47 m h 330 nf c24 100 nf c22 fb gnd 16 15 out1 boot1 15 nf c21 l3 l1 bead v dd con1 gnd v ss + 25 v - 25 v l2 bead v ddp v ssa on/off operate/mute v ddp v dda v ddp v ssp v ssa v ssp single ended output filter values c11 220 pf 2 3 TDA8920Bth
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 22 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er 13.9 curves measured in reference design v p = 27 v; 2 3 w se con?guration. (1) f = 6 khz. (2) 1 khz. (3) 100 hz. v p = 27 v; 2 4 w se con?guration. (1) f = 6 khz. (2) 1 khz. (3) 100 hz. fig 10. (thd + n)/s as a function of output power; se con?guration with 2 3 w load. fig 11. (thd + n)/s as a function of output power; se con?guration with 2 4 w load. v p = 27 v; 1 6 w btl con?guration. (1) f = 6 khz. (2) 1 khz. (3) 100 hz. v p = 27 v; 1 8 w btl con?guration. (1) f = 6 khz. (2) 1 khz. (3) 100 hz. fig 12. (thd + n)/s as a function of output power; btl con?guration with 1 6 w load. fig 13. (thd + n)/s as a function of output power; btl con?guration with 1 8 w load. p o (w) 10 - 2 10 3 10 2 10 - 1 10 1 001aab225 10 - 1 10 - 2 10 1 10 2 10 - 3 (1) (2) (3) (thd + n)/s (%) 001aab226 10 - 1 10 - 2 10 1 10 2 10 - 3 p o (w) 10 2 10 10 - 1 10 - 2 1 (2) (3) (1) (thd + n)/s (%) p o (w) 10 - 2 10 3 10 2 10 - 1 10 1 001aab227 10 - 1 10 - 2 10 1 10 2 10 - 3 (2) (1) (3) (thd + n)/s (%) p o (w) 10 - 2 10 3 10 2 10 - 1 10 1 001aab228 10 - 1 10 - 2 10 1 10 2 10 - 3 (1) (2) (3) (thd + n)/s (%)
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 23 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er v p = 27 v; 2 3 w se con?guration. (1) p out = 1 w. (2) p out = 10 w. v p = 27 v; 2 4 w se con?guration. (1) p out = 10 w. (2) p out = 1 w. fig 14. (thd + n)/s as a function of frequency; se con?guration with 2 3 w load. fig 15. (thd + n)/s as a function of frequency; se con?guration with 2 4 w load. v p = 27 v; 1 6 w btl con?guration. (1) p out = 1 w. (2) p out = 10 w. v p = 27 v; 1 8 w btl con?guration. (1) p out = 1 w. (2) p out = 10 w. fig 16. (thd + n)/s as a function of frequency; btl con?guration with 1 6 w load. fig 17. (thd + n)/s as a function of frequency; btl con?guration with 1 8 w load. 001aab229 10 - 1 10 - 2 10 1 10 2 10 - 3 f (hz) 10 10 5 10 4 10 2 10 3 (1) (2) (thd + n)/s (%) 001aab230 10 - 1 10 - 2 10 1 10 2 10 - 3 f (hz) 10 10 5 10 4 10 2 10 3 (1) (2) (thd + n)/s (%) 001aab231 10 - 1 10 - 2 10 1 10 2 10 - 3 f (hz) 10 10 5 10 4 10 2 10 3 (1) (2) (thd + n)/s (%) 001aab232 10 - 1 10 - 2 10 1 10 2 10 - 3 f (hz) 10 10 5 10 4 10 2 10 3 (1) (2) (thd + n)/s (%)
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 24 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er v p = 27 v; 2 3 w se con?guration. (1) p out = 10 w. (2) p out = 1 w. v p = 27 v; 2 4 w se con?guration. (1) p out = 10 w. (2) p out = 1 w. fig 18. channel separation as a function of frequency; se con?guration with 2 3 w load. fig 19. channel separation as a function of frequency; se con?guration with 2 4 w load. v p = 27 v; f = 1 khz. (1) 2 3 w se con?guration. (2) 2 4 w se con?guration. (3) 1 6 w btl con?guration. (4) 1 8 w btl con?guration. v p = 27 v; f = 1 khz. (1) 2 3 w se con?guration. (2) 2 4 w se con?guration. (3) 1 6 w btl con?guration. (4) 1 8 w btl con?guration. fig 20. power dissipation as a function of total output power. fig 21. ef?ciency as a function of total output power. 001aab233 - 60 - 40 - 80 - 20 0 a cs (db) - 100 f (hz) 10 10 5 10 4 10 2 10 3 (1) (2) 001aab234 - 60 - 40 - 80 - 20 0 a cs (db) - 100 f (hz) 10 10 5 10 4 10 2 10 3 (1) (2) p o (w) 10 - 2 10 3 10 2 10 - 1 10 1 001aab235 16 8 24 32 p diss (w) 0 (3) (1) (4) (2) 001aab236 p o (w) 0 240 160 80 40 60 20 80 100 h (%) 0 (1) (3) (4) (2)
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 25 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er f = 1 khz. (1) 1 6 w btl con?guration. (2) 1 8 w btl con?guration. (3) 2 3 w se con?guration. (4) 2 4 w se con?guration. f = 1 khz. (1) 1 6 w btl con?guration. (2) 1 8 w btl con?guration. (3) 2 3 w se con?guration. (4) 2 4 w se con?guration. fig 22. output power as a function of supply voltage; thd + n = 0.5 %. fig 23. output power as a function of supply voltage; thd+n=10%. v i = 100 mv; r s = 5.6 k w ; c i = 330 pf; v p = 27 v. (1) 1 8 w btl con?guration. (2) 1 6 w btl con?guration. (3) 2 4 w btl con?guration. (4) 2 3 w btl con?guration. v i = 100 mv; r s = 0 w ; c i = 330 pf; v p = 27 v. (1) 1 8 w btl con?guration. (2) 1 6 w btl con?guration. (3) 2 4 w btl con?guration. (4) 2 3 w btl con?guration. fig 24. gain as a function of frequency; r s = 5.6 k w and c i = 330 pf. fig 25. gain as a function of frequency; r s = 0 w and c i = 330 pf. v s (v) 10 35 30 20 25 15 001aab237 80 120 40 160 200 p o (w) 0 (1) (3) (4) (2) v s (v) 10 35 30 20 25 15 001aab238 80 160 240 p o (w) 0 (1) (2) (3) (4) 001aab239 30 35 25 40 45 g (db) 20 f (hz) 10 10 5 10 4 10 2 10 3 (1) (3) (4) (2) 001aab240 30 35 25 40 45 g (db) 20 f (hz) 10 10 5 10 4 10 2 10 3 (1) (2) (3) (4)
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 26 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er 14. test information 14.1 quality information the general quality speci?cation for integrated circuits, snw-fq-611 is applicable. v p = 27 v; v ripple = 2 v (p-p). (1) both supply lines rippled. (2) one supply line rippled. v i = 100 mv; f = 1 khz. fig 26. .svrr as a function of frequency. fig 27. .output voltage as a function of mode voltage. v p = 27 v; r s = 5.6 k w ; 20 khz aes17 ?lter. (1) 2 3 w se con?guration and 1 6 w btl con?guration. (2) 2 4 w se con?guration and 1 8 w btl con?guration. fig 28. s/n ratio as a function of output power. 001aab241 - 60 - 40 - 80 - 20 0 svrr (db) - 100 f (hz) 10 10 5 10 4 10 2 10 3 (1) (2) 001aab242 v o (v) 10 - 3 10 - 5 10 - 4 1 10 - 1 10 - 2 10 10 - 6 v mode (v) 06 4 2 001aab243 40 80 120 s/n (db) 0 p o (w) 10 - 2 10 3 10 2 10 - 1 10 1 (1) (2)
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 27 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er 15. package outline fig 29. hsop24 package outline. unit a 4 (1) references outline version european projection issue date 03-02-18 03-07-23 iec jedec jeita mm + 0.08 - 0.04 3.5 0.35 dimensions (mm are the original dimensions) notes 1. limits per individual lead. 2. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot566-3 0 5 10 mm scale hsop24: plastic, heatsink small outline package; 24 leads; low stand-off height sot566-3 a max. detail x a 2 3.5 3.2 d 2 1.1 0.9 h e 14.5 13.9 l p 1.1 0.8 q 1.7 1.5 2.7 2.2 v 0.25 w 0.25 yz 8 0 q 0.07 x 0.03 d 1 13.0 12.6 e 1 6.2 5.8 e 2 2.9 2.5 b p c 0.32 0.23 e 1 d (2) 16.0 15.8 e (2) 11.1 10.9 0.53 0.40 a 3 a 4 a 2 (a 3 ) l p q a q d y x h e e c v m a x a b p w m z d 1 d 2 e 2 e 1 e 24 13 1 12 pin 1 index
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 28 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er fig 30. dbs23p package outline. unit a 2 references outline version european projection issue date iec jedec jeita mm 4.6 4.3 a 4 1.15 0.85 a 5 1.65 1.35 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot411-1 98-02-20 02-04-24 0 5 10 mm scale d l l 1 l 2 e 2 e c a 4 a 5 a 2 m l 3 e 1 q w m b p 1 d z e 2 e e 123 j dbs23p: plastic dil-bent-sil power package; 23 leads (straight lead length 3.2 mm) sot411-1 v m d x h e h non-concave view b : mounting base side b b e 1 b p cd (1) e (1) z (1) de d h ll 3 m 0.75 0.60 0.55 0.35 30.4 29.9 28.0 27.5 12 2.54 12.2 11.8 10.15 9.85 1.27 e 2 5.08 2.4 1.6 e h 6 e 1 14 13 l 1 10.7 9.9 l 2 6.2 5.8 e 2 1.43 0.78 2.1 1.8 1.85 1.65 4.3 3.6 2.8 q j 0.25 w 0.6 v 0.03 x 45 b
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 29 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er 16. soldering 16.1 introduction this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. wave soldering can still be used for certain surface mount ics, but it is not suitable for ?ne pitch smds. in these situations re?ow soldering is recommended. driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. 16.2 through-hole mount packages 16.2.1 soldering by dipping or by solder wave typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the speci?ed maximum storage temperature (t stg(max) ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 16.2.2 manual soldering apply the soldering iron (24 v or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 c and 400 c, contact may be up to 5 seconds. 16.3 surface mount packages 16.3.1 re?ow soldering re?ow soldering requires solder paste (a suspension of ?ne solder particles, ?ux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for re?owing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. typical re?ow peak temperatures range from 215 cto270 c depending on solder paste material. the top-surface temperature of the packages should preferably be kept: ? below 225 c (snpb process) or below 245 c (pb-free process) C for all bga, htsson..t and ssop..t packages
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 30 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er C for packages with a thickness 3 2.5 mm C for packages with a thickness < 2.5 mm and a volume 3 350 mm 3 so called thick/large packages. ? below 240 c (snpb process) or below 260 c (pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm 3 so called small/thin packages. moisture sensitivity precautions, as indicated on packing, must be respected at all times. 16.3.2 wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was speci?cally developed. if wave soldering is used the following conditions must be observed for optimal results: ? use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. ? for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. ? for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be ?xed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. a mildly-activated ?ux will eliminate the need for removal of corrosive residues in most applications. 16.3.3 manual soldering fix the component by ?rst soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the ?at part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 c and 320 c.
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 31 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er 16.4 package related soldering information [1] for more detailed information on the bga packages refer to the (lf)bga application note (an01026); order a copy from your philips semiconductors sales of?ce. [2] all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vapori zation of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . [3] for sdip packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. [4] hot bar soldering or manual soldering is suitable for pmfp packages. [5] these transparent plastic packages are extremely sensitive to re?ow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared re?ow soldering with peak temperature exceeding 217 c 10 c measured in the atmosphere of the re?ow oven. the package body peak temperature must be kept as low as possible. [6] these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot pene trate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposite d on the heatsink surface. [7] if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. [8] wave soldering is suitable for lqfp, qfp and tqfp packages with a pitch (e) larger than 0.8 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [9] wave soldering is suitable for ssop, tssop, vso and vssop packages with a pitch (e) equal to or larger than 0.65 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [10] image sensor packages in principle should not be soldered. they are mounted in sockets or delivered pre-mounted on ?ex foil . however, the image sensor package can be mounted by the client on a ?ex foil by using a hot bar soldering process. the appropri ate soldering pro?le can be provided on request. table 11: suitability of ic packages for wave, re?ow and dipping soldering methods mounting package [1] soldering method wave re?ow [2] dipping through-hole mount cpga, hcpga suitable -- dbs, dip, hdip, rdbs, sdip, sil suitable [3] - suitable through-hole-surface mount pmfp [4] not suitable not suitable - surface mount bga, htsson..t [5] , lbga, lfbga, sqfp, ssop..t [5] , tfbga, vfbga, xson not suitable suitable - dhvqfn, hbcc, hbga, hlqfp, hso, hsop, hsqfp, hsson, htqfp, htssop, hvqfn, hvson, sms not suitable [6] suitable - plcc [7] , so, soj suitable suitable - lqfp, qfp, tqfp not recommended [7] [8] suitable - ssop, tssop, vso, vssop not recommended [9] suitable - cwqccn..l [10] , wqccn..l [10] not suitable not suitable -
9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 32 of 34 philips semiconductors TDA8920B 2 100 w class-d power ampli?er 17. revision history table 12: revision history document id release date data sheet status change notice order number supersedes TDA8920B_1 20041001 preliminary data sheet - 9397 750 13356 -
philips semiconductors TDA8920B 2 100 w class-d power ampli?er 9397 750 13356 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 october 2004 33 of 34 18. data sheet status [1] please consult the most recently issued data sheet before initiating or completing a design. [2] the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the l atest information is available on the internet at url http://www.semiconductors.philips.com. [3] for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 19. de?nitions short-form speci?cation the data in a short-form speci?cation is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values de?nition limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. 20. disclaimers life support these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change noti?cation (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise speci?ed. 21. trademarks sil-pad is a registered trademark of the bergquist company. 22. contact information for additional information, please visit: http://www.semiconductors.philips.com for sales of?ce addresses, send an email to: sales.addresses@www.semiconductors.philips.com level data sheet status [1] product status [2] [3] de?nition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn).
? koninklijke philips electronics n.v. 2004 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. date of release: 1 october 2004 document order number: 9397 750 13356 published in the netherlands philips semiconductors TDA8920B 2 100 w class-d power ampli?er 23. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 quick reference data . . . . . . . . . . . . . . . . . . . . . 2 5 ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 functional description . . . . . . . . . . . . . . . . . . . 5 8.1 general . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8.2 pulse width modulation frequency . . . . . . . . . . 8 8.3 protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 8.3.1 overtemperature protection (otp) . . . . . . . . . 8 8.3.2 overcurrent protection (ocp) . . . . . . . . . . . . . 8 8.3.3 window protection (wp). . . . . . . . . . . . . . . . . 10 8.3.4 supply voltage protections . . . . . . . . . . . . . . . 10 8.4 differential audio inputs . . . . . . . . . . . . . . . . . 11 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11 10 thermal characteristics. . . . . . . . . . . . . . . . . . 12 11 static characteristics. . . . . . . . . . . . . . . . . . . . 12 12 dynamic characteristics . . . . . . . . . . . . . . . . . 13 12.1 switching characteristics . . . . . . . . . . . . . . . . 13 12.2 stereo and dual se application . . . . . . . . . . . 14 12.3 mono btl application . . . . . . . . . . . . . . . . . . . 15 13 application information. . . . . . . . . . . . . . . . . . 15 13.1 btl application . . . . . . . . . . . . . . . . . . . . . . . . 15 13.2 mode pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 13.3 output power estimation. . . . . . . . . . . . . . . . . 16 13.4 external clock . . . . . . . . . . . . . . . . . . . . . . . . . 16 13.5 heatsink requirements . . . . . . . . . . . . . . . . . . 17 13.6 output current limiting. . . . . . . . . . . . . . . . . . . 18 13.7 pumping effects . . . . . . . . . . . . . . . . . . . . . . . 19 13.8 application schematic . . . . . . . . . . . . . . . . . . . 20 13.9 curves measured in reference design . . . . . . 22 14 test information . . . . . . . . . . . . . . . . . . . . . . . . 26 14.1 quality information . . . . . . . . . . . . . . . . . . . . . 26 15 package outline . . . . . . . . . . . . . . . . . . . . . . . . 27 16 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 16.1 introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 29 16.2 through-hole mount packages . . . . . . . . . . . . 29 16.2.1 soldering by dipping or by solder wave . . . . . 29 16.2.2 manual soldering . . . . . . . . . . . . . . . . . . . . . . 29 16.3 surface mount packages . . . . . . . . . . . . . . . . 29 16.3.1 re?ow soldering . . . . . . . . . . . . . . . . . . . . . . . 29 16.3.2 wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 30 16.3.3 manual soldering . . . . . . . . . . . . . . . . . . . . . . 30 16.4 package related soldering information . . . . . . 31 17 revision history . . . . . . . . . . . . . . . . . . . . . . . 32 18 data sheet status. . . . . . . . . . . . . . . . . . . . . . . 33 19 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 20 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 21 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 22 contact information . . . . . . . . . . . . . . . . . . . . 33

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